Commercial Times Features Enlitech’s Silicon Photonics Metrology Strategy; Night Jar™ Empowers Wafer-Level On-Wafer Testing for the AI / CPO Era

feature report by the Commercial Times on November 12, 2025, highlights Enlitech’s recent strategic move into the semiconductor sector, targeting the high-growth market of Silicon Photonics (SiPh) metrology. The article notes that with the expansion of AI, High-Performance Computing (HPC), and data centers, coupled with the accelerated development of Co-Packaged Optics (CPO) and SiPh modules, the demand for silicon photonics measurement and validation is set to grow significantly in the coming years. Silicon photonics testing has long been an industry pain point due to its extremely high requirements for optical path alignment precision, low error tolerance, and limitations in wafer-level inspection efficiency.

“The silicon photonics business will start making significant contributions in 2026.” — Commercial Times

Addressing the trend of SiPh / PICs transitioning from R&D to mass production, Enlitech has launched the Night Jar™ silicon photonics testing solution. Centered on wafer-level On‑Wafer optical measurement, it helps engineering teams implement optical loss measurement and visualizable analysis at various test points such as WAT, CP, and FT. This allows for early evaluation of device performance, reducing the risks and costs associated with back-end packaging and CPO assembly.

“Silicon photonics testing has always been a pain point in the industry, primarily due to the extremely high precision required for optical path alignment and very low error tolerance.” — Commercial Times

What can Night Jar™ do?

• Coverage for WAT / CP / FT: Provides consistent optical loss and link-level characterization at both wafer and die levels.
• O-to-O (Optical-to-Optical) Measurement: Offers the metrological foundation for localizing, qualifying, and quantifying optical loss in optical waveguides and SiPh chips.
• Wafer-Level Optical Loss Mapping: High-speed, non-destructive inspection that helps in monitoring yield and process stability, establishing crucial checkpoints for mass production.
• Hyperspectral Imaging Inspection: Micron-level resolution enables visualization of loss locations, overcoming the spatial resolution and observation limitations of traditional “probe station + laser source” setups.
• IL / PDL Wafer Testing + Imaging Analysis: Supports key metrics such as Insertion Loss (IL) and Polarization Dependent Loss (PDL), combining image-based representation and power intensity analysis to easily correlate optical performance with layout design or process variations.

Enlitech continues to leverage its core optical technology capabilities—including spectral light sources, precision optical path control, and high-resolution measurement—to advance its silicon photonics metrology solutions. The company aims to help more SiPh / PIC teams accelerate their validation cycles, improve process controllability, and meet the production line demands of the AI and optoelectronic interconnect era.