- Source: Economic Daily News|Tzu-Cheng Chu|2025.11.20
- Original Title: "Enlitech Investor Conference/Tackling SiPh Testing Opportunities, NightJar Advances into the Critical Last Mile for CPO"
- News Link: Enlitech Investor Conference/Tackling SiPh Testing Opportunities, NightJar Advances into the Critical Last Mile for CPO
- 时间:2024/6/25-6/27
- 地点: Amsterdam, 荷蘭
- 展位:
- 官方网站:tandem PV International Workshop(点此链接)
- Date: 2024/6/25-6/27
- Location: Amsterdam, 荷蘭
- Booth:
- Official Website: tandem PV International Workshop (Click here)
A report from the Economic Daily News on November 20, 2025, highlighted key takeaways from Enlitech’s investor conference, noting that AI is accelerating the development of Silicon Photonics (SiPh) and Co-Packaged Optics (CPO). Related projects are already undergoing validation with major foundries and IC design clients, and demand for CPO inspection is expected to ramp up starting in 2026. The report mentioned that Enlitech has launched the Night Jar™, a silicon photonics chip inspection platform, to fill a critical “wafer-level optical inspection” gap before CPO mass production.
“Related projects are already undergoing validation with major foundries and IC design clients.” — Economic Daily News
“Targets the pre-mass production wafer-level optical inspection gap for CPO.” — Economic Daily News
As rack-level interconnects transition from copper wiring to SiPh CPO architecture, discovering optical loss anomalies in a Photonic Integrated Circuit (PIC) chip after the high-cost Electrical Integrated Circuit (EIC) packaging process can severely impact yield and increase costs. Night Jar™, centered on wafer-level On-Wafer optical inspection, helps teams pinpoint the source of optical loss at an earlier stage, mitigating back-end packaging risks and thereby improving the yield and efficiency of subsequent CPO packaging integration.
Key Features of the Night Jar™ Silicon Photonics Wafer Testing System
Image-Based Optical Measurement: Identifies the location, amount of light leakage, and corresponding structures of optical loss on PIC chips at the wafer stage. This supports rapid Failure Analysis (FA) and debugging to expedite problem isolation.
Wafer-Level Full Inspection and Mapping: Supports full-wafer scanning and can perform Wafer-Level Optical Loss Mapping, facilitating better control over yield and process stability.
WAT / CP / FT Test Coverage: Enables the integration of On-Wafer optical inspection at different testing stages, including WAT, CP, and FT, to ensure quality control before advanced packaging or CPO assembly.
Add-On Architecture, Compatible with Multiple Probe Station Brands: Can be integrated with and upgrade existing probe stations (for both engineering and automated mass production). The optical inspection module can be retrofitted without disrupting the original electrical testing workflow, lowering the barrier to entry and associated risks.
Support for 4–12 Inch Wafers: Covers wafer size requirements from R&D to mass production, facilitating a seamless testing transition from device development and process validation to high-volume manufacturing.
“NightJar features an ‘add-on’ architecture, making it compatible with any brand of probe station.” — Economic Daily News


