For Image Sensor

With the popularization of 5G and ADAS (Advanced Driver Assistance Systems) of EV (Electrical Vehicles) CMOS Imaging Sensor (CIS) chips and CIS Camera Modules (CCM) will explode. According to a survey report by a professional market research organization (Yole), CIS chips and CCM will reach 45.7 billion U.S. dollars in 2024, with an average annual compound growth rate of over 9.1%. The technology and quality of the products are the keys to success in end-user-market for CIS and CCM manufacturers. It is deeply relied on the sophisticated testing techniques and systems to advance the core technology and to improve the product quality. Enlitech is the leading company of photon-electron conversion inspection field and invest over decades in the non-destructive and optical inspection technology on CIS and CCM. We provide complete testing solutions which covers the whole industry chain including CIS wafer, CIS die, CIS chip, CIS module, and CIS camera. Solid technical capabilities and dedicated service attitude have made us deeply trusted by IC design houses, wafer manufacturers, camera module manufacturers, and 3C product companies.

Organic-Photoconductive Film CMOS Image Sensor

Microlens Design

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